(high Thermal Conductive)aluminum Base Copper Clad Laminate

Aluminum base CCL(For PCB use) Excellent thermal conductivity Excellent breakdown voltage

Aluminum Based Copper-clad Laminate SheetDescription and ApplicationAluminum based copper-clad laminate have excellent flame retardant, high mechanical strength,dimensional stability etc. Especially it has vey good heat sink, electromagnetic shielding and solderfloat.It is widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, soundbox, power supply module and acoustics shielding system etx.

Thickness: 1.2mm, 1.5mm, 2.0mmCopper Foil thickness: 18um, 35um, 70umBoardsize: 600mm x 500mm, 1200mm x 500mm, 1200mm x 600mm

150um Dielectric layer

	Test item		U.	Assay
1	Peel Strength	A	N/mm	2.0
		After thermal stress(260°C)	N/mm	1.8
2	Blister test After Thermal stress		/	(260°C,2min) No slice,No blister
3	Thermal resistance		°C/W	1.0
4	Thermal-conductive Factor		W/m·k	1.0
5	Flammability(A)		/	FV-0
`	Surface Resistivity	A	MΩ	5×107
		Constant humidity treatment(25°C~65°C, RH:90%~98%,20 circulate)		2×106
7	Volume Resistivity	normal	MΩ	4×108
		Constant humidity treatment(25°C~65°C, RH:90%~98%,20 circulate)		5×107
8	Dielectric Breakdown AC (leakage 5mA)		KV	6
9	Dielectric constant (1MHZ)(40°C,93%,96h)		/	4.2
10	Dielectric dissipation factor (1MHZ)(40°C,93%,96h)		/	0.02
11	CTI		V	230
12	Operating Breakdown (AC)		V	960

 

(high Thermal Conductive)aluminum Base Copper Clad Laminate